Interplex, provider of customised application solutions, has announced availability of the new BusMate® Power Busbar Coupler, which is designed to maximise configuration options for product engineers to integrate busbars in power devices.
BusMate® provides a compact, pluggable, and economical interface for connecting busbars to a variety of small PCBs, using either SMT or Press-Fit configurations. The technology can support a wide range of designs, including blade-to-blade, moulded connectors, busbar-to-SMT and other applications. This gives engineers a highly reliable and assembly-friendly solution for new power designs.
Key features of the BusMate® Power Busbar Coupler include:
- Small footprint: 8.4 x 6 x 9.9 mm (X, Y, Z).
- Large ampacity-to-size ratio.
- Rated up to 80 Amps, or higher by using active or passive cooling designs.
- Floating Contact Technology accommodates large assembly tolerances: ±0.8 Mating Blade Offset or Twist.
- High temperature construction: 150° C.
- Up to three re-mate cycles.
- Configurable for: Board-to-Blade, Board-to-Board, or Blade-to-Blade.
According to Joe Lynch, Product Portfolio Director, “As smaller and more powerful product designs require compact, efficient, and reliable busbar interconnects for higher power densities, the BusMate® Power Busbar Coupler is giving designers new options. BusMate®’s design flexibility and Floating Contact Technology enables usage across a wide range of requirements, while assuring excellent electrical performance and cost-effective assembly.”
BusMate® is especially helpful for applications such as motors and pumps, hybrid vehicle power systems, electric power steering, charging systems, power mechatronics, Brushless Servo Motor (BLDC) systems, Traction-Drive Inverter Busbar systems and other emerging power applications. These applications span a variety of industries including Electric Vehicles, e-Mobility, Charging Stations, Energy, Transportation, Industrial, Information & Communications Technology, and Medical & Life Sciences.